Electronic module housing and assembly with integral heatsink

Details Electronic module housing and assembly with integral heatsink Electronic module housing and assembly with integral heatsink

1992-01-31

1993-05-18

Donovan, Lincoln

Electricity: electrical systems and devices

Electrostatic capacitors

Fixed capacitor

361388, 361392, 361399, 165 803, 174 163, H05K 720

Patent

active

052126277

ABSTRACT:
An electronic module housing (30) with an integral heatsink (32) is provided as part of an electronic module assembly (31). The heatsink (32) has a general U-shape formed by a pair of opposing sidewalls (33, 34) rising upward from a central intermediate portion (37) having a planar surface (38) for mounting a module substrate thereon. Plastic housing material is molded about the heatsink so as to form an interior module receiving cavity (50). The cavity is generally defined by the heatsink sidewalls (33, 34) and a pair of molded plastic opposing sidewalls (55, 56) provided between the heatsink sidewalls. Preferably heat conductive mounting ear portions (40, 41) extend from ends (43, 44) of the heatsink sidewalls and permit thermally mounting the housing to another heatsinking structure. Preferably molded interior plastic sidewalls (57, 58) separate the heatsink sidewalls (33, 34) from the cavity (50). The preferred housing and assembly configuration has reduced size and weight and provides sufficient mechanical protection and increased thermal power dissipation for a module (39 ) in the cavity.

REFERENCES:
patent: D284587 (1986-07-01), Cox et al.
patent: 4901203 (1990-02-01), Kobayashi et al.
patent: 4905123 (1990-02-01), Windle et al.
"Motorola Solid State Relay/Driver, Advance Information Product Description", Aug. 1990.
"Motorola 25-51 Service Manual, MA/MH and MR Series Alternator Systems", pp. 2, 14, 29, 30, 1969.
"Motorola MAPI Service Bulletin No. 30", Apr. 1969.

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