Electronic module having thermal cooling insert

Details Electronic module having thermal cooling insert Electronic module having thermal cooling insert

2011-01-25

2011-01-25

Pape, Zachary M (Department: 2835)

Electricity: electrical systems and devices

Housing or mounting assemblies with diverse electrical...

For electronic systems and devices

C361S715000, C165S080400, C165S080500, C165S104330, C257S714000, C257S716000, C174S015100, C174S547000, C123S041310, C138S039000, C138S040000, C137S599010, C137S56100R

Reexamination Certificate

active

07876562

ABSTRACT:
An electronic module is provided having enhanced thermal cooling of electronics. The module includes a housing, electronic circuitry contained within the housing, and a fluid cooling chamber extending through the housing. The chamber has generally conical shaped portions at opposite ends. At least one thermal cooling insert extends into the chamber. The insert comprises a plurality of projections for forming fluid flow passages between adjacent projections, wherein the projections engage the generally conical shape portion of the chamber.

REFERENCES:
patent: 1506722 (1924-08-01), Yunker
patent: 2895508 (1959-07-01), Drake
patent: 5841634 (1998-11-01), Visser
patent: 6396692 (2002-05-01), Farshi et al.
patent: 2002/0166519 (2002-11-01), Skrzypchak et al.
patent: 2004/0257757 (2004-12-01), Schweinbenz et al.
patent: 2006/0291165 (2006-12-01), Flesch et al.
patent: 2007/0289718 (2007-12-01), McCordic et al.
European Search Report dated Jul. 9, 2009.

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