Active solid-state devices (e.g. – transistors – solid-state diode – Housing or package – Multiple housings
Reexamination Certificate
2005-05-31
2005-05-31
Vigushin, John B. (Department: 2841)
Active solid-state devices (e.g., transistors, solid-state diode
Housing or package
Multiple housings
C257S675000, C257S707000, C257S723000, C257S724000, C361S719000, C361S767000, C361S771000, C361S782000, C361S783000
Reexamination Certificate
active
06900529
ABSTRACT:
An improved multi-chip module includes a main circuit board having an array of electrical interconnection pads to which are mounted a plurality of IC package units. Each IC package unit includes a pair of IC packages, both of which are mounted on opposite sides of a package carrier. The package units may be mounted on one or both sides of the main circuit board. A first primary embodiment of the invention employs a laminar package carrier having a pair of major planar surfaces. Each planar surface incorporates electrical contact pads. One IC package is surface mounted on each major planar surface, by interconnecting the leads of the package with the contact pads on the planar surface, to form the IC package unit. Several different variations of the chip module are disclosed.
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Engle Jason C.
Kledzik Kenneth J.
Legacy Electronics, Inc.
Schwartz Sung & Webster
Vigushin John B.
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