Electronic module for removing heat from a semiconductor die

Details Electronic module for removing heat from a semiconductor die Electronic module for removing heat from a semiconductor die

1994-05-02

1996-10-15

Mintel, William

Active solid-state devices (e.g., transistors, solid-state diode

Housing or package

With provision for cooling the housing or its contents

257723, 257725, H01L 2334

Patent

active

055657052

ABSTRACT:
An electronic module (10) for removing heat from a semiconductor die (41) and a method of making the electronic module (10). The electronic module (10) has a baseplate (11) mated with an isolation structure (23). The isolation structure (23) has three portions: a first portion is bonded to the top surface (12) of the baseplate (11), a second portion is bonded to the bottom surface (13) of the baseplate (11), and a third portion is bonded to a side (14) of the baseplate (11). A semiconductor die (41) is bonded to the first portion of the isolation structure (23) and another semiconductor die (41) is bonded to the second portion of the isolation structure (23). The baseplate (11) has a cavity (20) through which a fluid flows and transports heat away from each semiconductor die (41).

REFERENCES:
patent: 4727454 (1988-02-01), Neidig et al.
patent: 4774632 (1988-09-01), Neugebauer
patent: 4990462 (1991-02-01), Sliwa, Jr.
patent: 5001548 (1991-03-01), Iversen
patent: 5020583 (1991-06-01), Aghajanian et al.
patent: 5126829 (1992-06-01), Daikoku et al.
patent: 5216279 (1993-06-01), Nakao
patent: 5221558 (1993-06-01), Sonuparlak et al.
patent: 5222542 (1993-06-01), Burke
patent: 5386341 (1995-01-01), Olson et al.
Document No. 07972347 Name Anderson et al. Filing Date Nov. 6, 1992.
Document No. 08176598 Name Romero et al. Filing Date Jan. 3, 1994.
Document No. 08190974 Name Romero et al. Filing Date Feb. 3, 1994.
Document No. 08130824 Name Romero Filing Date Oct. 4, 1993.
"Metal-Matrix Composites for Electronic Packaging," by Carl Zweben JOM, vol. 44, Iss 7, pp. 15-23, Jul. 1992.

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