Electronic module enclosure

Details Electronic module enclosure Electronic module enclosure

1993-07-09

1996-04-09

Kincaid, Kristine L.

Electricity: conductors and insulators

Anti-inductive structures

Conductor transposition

361818, H05K 900

Patent

active

055063730

ABSTRACT:
In a preferred embodiment, an enclosure for an electronic module containing an electronic component having upper and lower surfaces, the enclosure including: a top cover shield overlying, and substantially covering, in closely spaced relationship, the upper surface of the electronic component; a bottom cover shield underlying, and substantially covering, in closely spaced relationship, the lower surface of the electronic component; and the top and bottom cover shields being cojoined so as to substantially enclose the electronic component.

REFERENCES:
patent: 4499523 (1985-02-01), Gillett et al.
patent: 4656559 (1987-04-01), Fathi
patent: 4658334 (1987-04-01), McSparran et al.
patent: 4810589 (1989-03-01), Kuwamoto et al.
patent: 4811165 (1989-03-01), Currier et al.
patent: 4831498 (1989-05-01), Baba
patent: 5070430 (1991-12-01), Meusel et al.
patent: 5095177 (1992-03-01), Johnson
patent: 5323299 (1994-06-01), Weber
patent: 5333100 (1994-07-01), Anhalt et al.
patent: 5339222 (1994-08-01), Simmons et al.
patent: 5353201 (1994-10-01), Maeda
patent: 5386340 (1995-01-01), Kurz
patent: 5387764 (1995-02-01), Blom et al.
patent: 5392197 (1995-02-01), Cuntz et al.

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