Electronic module cooling system using parallel air streams

Electricity: electrical systems and devices – Electrostatic capacitors – Fixed capacitor

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165126, 174 16R, H05K 720

Patent

active

044491646

ABSTRACT:
The cooling of electronic modules on a circuit board is improved by the use of heat sinks comprising a plurality of longitudinal fins projecting from the modules. Individual tubes communicating with an air plenum fit around and part way along each heat sink. Air drawn from or forced into the plenum causes air flow within the tubes and along the fins to cool them and the modules to which they are attached.

REFERENCES:
patent: 2380026 (1945-07-01), Clark
patent: 3198990 (1965-08-01), Katzin
patent: 3790859 (1974-02-01), Schraeder et al.
patent: 4103737 (1978-08-01), Perkins
patent: 4158875 (1979-06-01), Tajima et al.
patent: 4277816 (1981-07-01), Dunn
patent: 4296455 (1981-10-01), Leaycraft et al.
"Jet Cooling . . . Devices," IBM Tech. Discl. Bull., vol. 20, No. 9, Feb. 1978, Keller & Moran, pp. 3575, 3576.

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