Electronic module comprising a stack of IC chips each interactin

Details Electronic module comprising a stack of IC chips each interactin Electronic module comprising a stack of IC chips each interactin

1994-06-08

1995-07-11

Popek, Joseph A.

Static information storage and retrieval

Interconnection arrangements

365 51, 257686, 257673, 257777, H01L 2700

Patent

active

054327296

ABSTRACT:
An electronic module comprising a multiplicity of prestacked IC chips, such as memory chips, and an IC chip, referred to as an active substrate or active backplane, to which the stack of chips is directly secured. A multiplicity of aligned solder bumps may interconnect the stack and the substrate, providing electrical, mechanical and thermal interconnection. The active substrate is a layer containing substantial amounts of integrated circuitry, which interfaces, on one hand, with the integrated circuitry in the stacked chips, and, on the other hand, with the external computer bus system. Some of the high priority circuitry which may be included in the substrate is used for control, fault-tolerance, buffering, and data management.

REFERENCES:
patent: 4754316 (1988-06-01), Reid
patent: 4983533 (1991-01-01), Go
patent: 5019943 (1991-05-01), Fassbender
patent: 5311401 (1994-05-01), Gates, Jr.
patent: 5313096 (1994-05-01), Eide

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