Electronic module comprising a first substrate element with a fu

Details Electronic module comprising a first substrate element with a fu Electronic module comprising a first substrate element with a fu

1989-04-24

1990-10-30

Eisenzopf, Reinhard J.

Electricity: measuring and testing

Plural, automatically sequential tests

371 201, G01R 3102

Patent

active

049671421

ABSTRACT:
An electronic, digital IC module includes a substrate element on which is formed a test integrated circuit for the execution of a boundary scan on a standard integrated circuit formed on another substrate element. Either the substrate for the test circuit is provided in an electronic sub-module on which is formed a test socket, in which case the standard circuit is mounted piggy-back, or a hybrid package is provided composed of the two substrate elements which are interconnected by bond pads. The test circuit includes a shift register for parallel connection to the standard circuit and serial connection to an external test unit.

REFERENCES:
patent: 4703483 (1987-10-01), Enomoto et al.
patent: 4799004 (1989-01-01), Mori
patent: 4829237 (1989-05-01), Segawa et al.

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