Electronic module and method of assembling the same

Details Electronic module and method of assembling the same Electronic module and method of assembling the same

2005-10-25

2008-10-28

Dang, Trung (Department: 2892)

Active solid-state devices (e.g., transistors, solid-state diode

Lead frame

With structure for mounting semiconductor chip to lead frame

C257S686000, C257SE23044, C257SE23052

Reexamination Certificate

active

07443014

ABSTRACT:
An electronic module includes a semiconductor power switch and a semiconductor diode. The lower side of the semiconductor power switch includes an output contact mounted on a die pad of a leadframe, and the upper side of the semiconductor power switch includes a control contact and an input contact. The anode contact of the semiconductor diode is disposed on and electrically connected to the input contact of the semiconductor power switch. The cathode contact of the diode is electrically connected with the output contact of the power semiconductor switch.

REFERENCES:
patent: 6144093 (2000-11-01), Davis et al.
patent: 6404050 (2002-06-01), Davis et al.
patent: 7195952 (2007-03-01), Vinn et al.
patent: 2002/0113247 (2002-08-01), Magri et al.
patent: 2004/0169262 (2004-09-01), Oliver et al.

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