Electronic module and a data carrier having an electronic module

Details Electronic module and a data carrier having an electronic module Electronic module and a data carrier having an electronic module

1995-12-05

1998-11-10

Gross, Anita Pellman

Registers

Records

Conductive

235488, 257669, G06K 1900

Patent

active

058347550

ABSTRACT:
A lead frame module to be incorporated in data carriers is presented which is divided into two areas, namely a central area receiving the sensitive components of the module, and an outer area protruding beyond the edge of the central area and serving to glue the lead frame module to the data carrier. To prevent forces from being transmitted from the outer area of the electronic module to the central area upon bending loads of the data carrier, the outer area is decoupled mechanically from the central area. This can be done for example by providing partial discontinuities including relieving punchings in the transition between the central and outer area.

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Patent Abstract of Japan; Publication No. 02030598 (Jan. 1990); Japanese Patent Application No. 63181309 filed Jul. 20, 1988.

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