Electricity: electrical systems and devices – Housing or mounting assemblies with diverse electrical... – For electronic systems and devices
Reexamination Certificate
2005-03-22
2005-03-22
Martin, David (Department: 2841)
Electricity: electrical systems and devices
Housing or mounting assemblies with diverse electrical...
For electronic systems and devices
C361S818000, C361S800000, C361S801000, C439S607560, C439S487000
Reexamination Certificate
active
06870746
ABSTRACT:
An electronic module having a configuration for promoting efficient heat dissipation and a circuit board assembly are provided such that when the electronic module is inserted within the circuit board assembly a portion of the electronic module overlaps an EMI shield, with the portion of the electronic module having a configuration for promoting efficient heat dissipation and being external of the EMI shield.
REFERENCES:
patent: 6071016 (2000-06-01), Ichino et al.
patent: 6282092 (2001-08-01), Okamoto et al.
patent: 6290540 (2001-09-01), Nishio et al.
patent: 6459517 (2002-10-01), Duncan et al.
patent: 6508595 (2003-01-01), Chan et al.
patent: 6599151 (2003-07-01), Chiran et al.
Everett Keith
Leeson Kim
Agilent Technologie,s Inc.
Martin David
Phan Thanh S.
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