Electricity: electrical systems and devices – Housing or mounting assemblies with diverse electrical... – For electronic systems and devices
Patent
1997-05-19
1999-10-05
Thompson, Gregory
Electricity: electrical systems and devices
Housing or mounting assemblies with diverse electrical...
For electronic systems and devices
361715, 361790, 361796, 361803, H05K 720
Patent
active
059634260
ABSTRACT:
A multilayer microelectronic module assembly has at least two planar module structures, in the form of boards lying parallel to each other and which must be electrically interconnected. Each planar module structure has electronic circuitry thereon and electrical interconnect locations in registry with corresponding electrical interconnect locations on the adjacent planar module structure. The electrical interconnections are accomplished by closely spaced direct electrical interconnectors extending between the respective electrical interconnection locations on the adjacent planar module structures. Each module assembly is preferably affixed to a support. Multiple supports are arranged parallel to each other and electrically interconnected by similar direct electrical interconnectors. By accomplishing the electrical interconnections using direct electrical interconnectors rather than a conventional backplane, there is room at the periphery of the planar module structures for attachment to a thermally conductive heat sink, which efficiently removes heat generated by the electronic circuitry on the planar module structures.
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patent: 4453795 (1984-06-01), Moulin
patent: 4764846 (1988-08-01), Go
patent: 5197184 (1993-03-01), Crumly et al.
patent: 5307561 (1994-05-01), Feigenbaum et al.
Audi "Colling and Minimizing Temperature Gradient In Stacked Modules" IBM Tech Disc Bulletin, vol. 19, No. 2, Jul. 1976, p. 414. 361/707.
Hayden Warren W.
Williams Ronald L.
Alkov Leonard A.
Lenzen, Jr. Glenn H.
Raufer Colin M.
Raytheon Company
Thompson Gregory
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