Electronic micropackage for an electronic memory card

Active solid-state devices (e.g. – transistors – solid-state diode – Housing or package – Smart card package

Patent

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Details

257668, 257678, 257692, 257730, H01L 2302, H01L 23495, H01L 2348, H01L 2304

Patent

active

058775447

ABSTRACT:
An electronic micropackage for an electronic memory card, particularly applicable to large-sized semiconductor chips. The micropackage includes a semiconductor chip disposed on a first face of an insulating support, and electrical contact zones extending along a plane defined by a second face of the insulating support. The semiconductor chip is connected to the electrical contact zones via connection wires. A metal strip is provided with cut-outs defining the electrical contact zones. A strip of insulating material is disposed on one face of the metal strip, the strip of insulating material constituting said insulating support, and leaving uncovered, at least in part, the electrical contact zones. A housing for the semiconductor chip, surrounding the insulating support and obstructing those cut-outs in the metal strip which are inside the housing and which are not obstructed by the insulating support. A coating of resin covers the semiconductor chip and the connection wires, at least partially filling the housing.

REFERENCES:
patent: 4955132 (1990-09-01), Ozawa
patent: 5070390 (1991-12-01), Shimizu
patent: 5382829 (1995-01-01), Inoue
patent: 5399903 (1995-03-01), Rostoker et al.
patent: 5455454 (1995-10-01), Oh et al.
patent: 5598031 (1997-01-01), Grover et al.

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