Electronic micromodule and method for manufacturing the same

Details Electronic micromodule and method for manufacturing the same Electronic micromodule and method for manufacturing the same

2006-11-20

2010-02-23

Smith, Bradley K (Department: 2894)

Active solid-state devices (e.g., transistors, solid-state diode

Combined with electrical contact or lead

Of specified configuration

C257S777000, C257S486000, C438S597000, C438S612000

Reexamination Certificate

active

07667329

ABSTRACT:
A method for manufacturing a micromodule comprising an integrated circuit and an antenna coil electrically connected to the integrated circuit. The method includes manufacturing the integrated circuit and first contact pads of the integrated circuit on a first wafer of semiconductor material, making a conductive winding forming a coil and second contact pads of the coil on a second wafer of semiconductor material, and assembling the first and the second wafers face to face while putting the second contact pads of the coil in contact with the second contact pads of the integrated circuit.

REFERENCES:
patent: 5387551 (1995-02-01), Mizoguchi et al.
patent: 6268796 (2001-07-01), Gnadinger et al.
patent: 1 069 645 (2001-01-01), None
patent: 1 467 315 (2004-10-01), None
patent: 00/77852 (2000-12-01), None
patent: 01/45164 (2001-06-01), None

Affiliated with

Also associated with

Rating

Electronic micromodule and method for manufacturing the same does not yet have a rating. At this time, there are no reviews or comments for this patent.

If you have personal experience with Electronic micromodule and method for manufacturing the same, we encourage you to share that experience with our LandOfFree.com community. Your opinion is very important and Electronic micromodule and method for manufacturing the same will most certainly appreciate the feedback.

Rate now

Comments { 0 }

Profile ID: LFUS-PAI-O-4197189