Electronic micro-component self-sealed under vacuum, notably dio

Details Electronic micro-component self-sealed under vacuum, notably dio Electronic micro-component self-sealed under vacuum, notably dio

1994-08-15

1997-04-29

Patel, Nimeshkumar

Electric lamp and discharge devices

Discharge devices having a multipointed or serrated edge...

313310, 313336, 313351, 313495, H01J 130

Patent

active

056252501

ABSTRACT:
The disclosure concerns the making of microcomponents belonging to the family of vacuum tubes of the diode, triode and electroluminescent component type. The goal thereof is notably to resolve problems of fabrication under vacuum, and of precise anode-cathode spacing. This goal is achieved by means of a microcomponent of the stacked structure type wherein the anode is made in the form of a metallic layer for the sealing of said cavity under vacuum containing the microcathode, and wherein at least one solid dielectric layer provides for the spacing between said anode and said microcathode.

REFERENCES:
patent: 4113896 (1978-09-01), Keiner et al.
patent: 4410832 (1983-10-01), Smith et al.
patent: 4721885 (1988-01-01), Brodie
patent: 4908539 (1990-03-01), Meyer
patent: 5127990 (1992-07-01), Pribat et al.
patent: 5136205 (1992-08-01), Sokolich et al.

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