Electricity: electrical systems and devices – Housing or mounting assemblies with diverse electrical... – For electronic systems and devices
Reexamination Certificate
2008-05-19
2010-06-29
Datskovskiy, Michael V (Department: 2835)
Electricity: electrical systems and devices
Housing or mounting assemblies with diverse electrical...
For electronic systems and devices
C361S695000, C361S679480, C361S679490, C454S184000
Reexamination Certificate
active
07746637
ABSTRACT:
An electronic equipment enclosure includes a frame structure, one or more enclosure panels mounted on the frame structure, an exhaust duct, and a plurality of adjustable filler panel assemblies. The frame structure and the one or more enclosure panels together define an enclosure. The exhaust duct is substantially the same height as the enclosure and has an air inlet opening formed therein for receipt of exhaust air from equipment mounted in the enclosure. The plurality of adjustable filler panel assemblies selectively block portions of the air inlet opening in order to create a custom-fit air inlet opening for a particular piece of equipment so that exhaust air from the equipment does not flow back into the enclosure after entering the exhaust duct.
REFERENCES:
patent: 3192306 (1965-06-01), Skonnard
patent: 4467584 (1984-08-01), Crites et al.
patent: 4541219 (1985-09-01), Parker
patent: 4592602 (1986-06-01), Kuster et al.
patent: 4774631 (1988-09-01), Okuyama et al.
patent: 5165770 (1992-11-01), Hahn
patent: 5216579 (1993-06-01), Basara et al.
patent: 5250752 (1993-10-01), Cutright
patent: 5294748 (1994-03-01), Schwenk et al.
patent: 5528454 (1996-06-01), Niklos
patent: 5544012 (1996-08-01), Koike
patent: 5639150 (1997-06-01), Anderson et al.
patent: 5671805 (1997-09-01), Stahl et al.
patent: 5695263 (1997-12-01), Simon et al.
patent: 5791498 (1998-08-01), Mills
patent: 5806945 (1998-09-01), Anderson et al.
patent: 5806946 (1998-09-01), Benner et al.
patent: 5851143 (1998-12-01), Hamid
patent: 5941767 (1999-08-01), Fukuda
patent: 5995368 (1999-11-01), Lee et al.
patent: 6034873 (2000-03-01), Stahl et al.
patent: 6044193 (2000-03-01), Szentesi et al.
patent: 6067233 (2000-05-01), English et al.
patent: D432098 (2000-10-01), Nelson et al.
patent: 6163454 (2000-12-01), Strickler
patent: 6198628 (2001-03-01), Smith
patent: 6373721 (2002-04-01), Lecinski et al.
patent: 6462944 (2002-10-01), Lin
patent: 6554697 (2003-04-01), Koplin
patent: 6557357 (2003-05-01), Spinazzola et al.
patent: 6574970 (2003-06-01), Spinazzola et al.
patent: 6601932 (2003-08-01), Helgenberg et al.
patent: 6616524 (2003-09-01), Storck et al.
patent: 6652373 (2003-11-01), Sharp et al.
patent: 6745579 (2004-06-01), Spinazzola et al.
patent: 6788535 (2004-09-01), Dodgen et al.
patent: 6819563 (2004-11-01), Chu et al.
patent: 6854284 (2005-02-01), Bash
patent: 6867967 (2005-03-01), Mok
patent: 7011576 (2006-03-01), Sharp et al.
patent: 7033267 (2006-04-01), Rasmussen
patent: 7074123 (2006-07-01), Bettridge et al.
patent: 7112131 (2006-09-01), Rasmussen et al.
patent: 7154748 (2006-12-01), Yamada
patent: 7182208 (2007-02-01), Tachibana
patent: 7236362 (2007-06-01), Wang et al.
patent: 7255640 (2007-08-01), Aldag et al.
patent: 7259963 (2007-08-01), Germagian et al.
patent: 7286345 (2007-10-01), Casebolt
patent: 7293666 (2007-11-01), Mattlin et al.
patent: 7309279 (2007-12-01), Sharp et al.
patent: 7349209 (2008-03-01), Campbell et al.
patent: 7425678 (2008-09-01), Adducci et al.
patent: 7427713 (2008-09-01), Adducci et al.
patent: 7472970 (2009-01-01), Bergesch et al.
patent: 7485803 (2009-02-01), Adducci et al.
patent: 7486512 (2009-02-01), Campbell et al.
patent: 7495169 (2009-02-01), Adducci et al.
patent: 7504581 (2009-03-01), Adducci et al.
patent: 7508663 (2009-03-01), Coglitore
patent: 7542287 (2009-06-01), Lewis, II et al.
patent: 7604535 (2009-10-01), Germagian et al.
patent: 2004/0007348 (2004-01-01), Stoller
patent: 2004/0099747 (2004-05-01), Johnson et al.
patent: 2004/0190270 (2004-09-01), Aldag et al.
patent: 2004/0201335 (2004-10-01), Davis
patent: 2005/0029910 (2005-02-01), Woods
patent: 2005/0170770 (2005-08-01), Johnson et al.
patent: 2005/0225936 (2005-10-01), Day
patent: 2006/0276121 (2006-12-01), Rasmussen
patent: 2008/0062654 (2008-03-01), Mattlin et al.
patent: 2008/0068791 (2008-03-01), Ebermann
patent: 2008/0316702 (2008-12-01), Donowho et al.
patent: 2009/0129013 (2009-05-01), Donowho et al.
patent: 2009/0190307 (2009-07-01), Krietzman
patent: 2009/0227197 (2009-09-01), Lewis, II et al.
patent: 2009/0239460 (2009-09-01), Lucia et al.
patent: 2009/0239461 (2009-09-01), Lewis, II et al.
patent: 2509487 (1976-09-01), None
patent: 20207426 (2002-09-01), None
patent: 02000286580 (2000-10-01), None
patent: 2004-2000594 (2004-07-01), None
patent: 2004-252758 (2004-09-01), None
patent: 2006055506 (2006-05-01), None
patent: 2008144678 (2008-11-01), None
patent: 2009089008 (2009-07-01), None
patent: 2009103090 (2009-08-01), None
patent: 2009103090 (2009-10-01), None
Rasmussen, Neil, “Air Distribution Architecture Options for Mission Critical Facilities”, White Paper #55, 2003, pp. 1-13, Revision 1, American Power Conversion (APC), West Kingston, Rhode Island.
Information Disclosure Statement (IDS) Letter Regarding Common Patent Application(s), submitted by Applicant on Sep. 18, 2009.
Information Disclosure Statement (IDS) Letter Regarding Common Patent Application(s), dated Nov. 3, 2009.
“International Search Report” and “Written Opinion” of the International Search Authority (Korean Intellectual Property Office) in Chatsworth Products, Inc. et al., International Patent Application Serial No. PCT/US2009/034338, filed on Feb. 17, 2003 mailed on Sep. 1, 2009 and completed on Aug. 31, 2009, 7 pages.
“International Search Report” and “Written Opinion of the International Search Authority” (Korean Intellectual Property Office) in Chatsworth Products, Inc. et al., International Patent Application Serial No. PCT/US2008/064174, filed May 19, 2008, 9 pages.
Chatsworth Products, Inc., “Thermal Management Solutions”, Signature Solutions Brochure, Revision dated Mar. 2008, 6 pages, www.chatsworth.com/passivecooling.
Donowho D. Brian
Lewis, II Richard Evans
Chatsworth Products, Inc.
Datskovskiy Michael V
Tillman Chad D.
Tillman Wright PLLC
Wright James D.
LandOfFree
Electronic equipment enclosure with exhaust air duct and... does not yet have a rating. At this time, there are no reviews or comments for this patent.
If you have personal experience with Electronic equipment enclosure with exhaust air duct and..., we encourage you to share that experience with our LandOfFree.com community. Your opinion is very important and Electronic equipment enclosure with exhaust air duct and... will most certainly appreciate the feedback.
Profile ID: LFUS-PAI-O-4216503