Electricity: electrical systems and devices – Housing or mounting assemblies with diverse electrical... – For electronic systems and devices
Patent
1992-08-28
1994-07-19
Tolin, Gerald P.
Electricity: electrical systems and devices
Housing or mounting assemblies with diverse electrical...
For electronic systems and devices
16510433, 174 152, 361719, H05K 720
Patent
active
053315103
ABSTRACT:
An electronic equipment has heat pipes for radiating heat generated from heat generating electronic parts. The electronic parts are arranged such that electronic parts generating more heat are arranged nearer to a heat radiating portion of each heat pipe to prevent a phenomenon of dryout and radiate the heat efficiently, whereby heat generated from the electronic parts such as LSI chips can be effectively radiated and an excessive rise in temperature of the electronic parts can be suppressed. When the invention is applied to computers, the entire computer size can be reduced.
REFERENCES:
patent: 3788393 (1974-01-01), Plizak
patent: 4120019 (1978-10-01), Arii
patent: 4204246 (1980-05-01), Arii
patent: 4327399 (1982-04-01), Sasaki
patent: 5087888 (1992-02-01), Mountz
patent: 5095404 (1992-03-01), Chao
patent: 5199165 (1993-04-01), Crawford
"Heat Pipe . . . ", Kerjilian, IBM Tech Discl Bull vol. 18 No. 12 May 1976 pp. 3982, 3983.
Kaji Ryuichi
Morihara Atsushi
Naganuma Yoshio
Ouchi Katsunori
Sato Koji
Hitachi , Ltd.
Tolin Gerald P.
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