Electronic endoscope with a mask bump bonded to an image pick-up

Details Electronic endoscope with a mask bump bonded to an image pick-up Electronic endoscope with a mask bump bonded to an image pick-up

1990-05-25

1991-08-13

Britton, Howard W.

Facsimile and static presentation processing

Facsimile

Recording apparatus

358 98, 358229, 358209, H04N 314, H04N 5335

Patent

active

050400690

ABSTRACT:
Described herein is a solid image pickup assembly for use in an electronic endoscope, including a substrate having a mask defining a masked area bearing wiring patterns and an image pickup area in the form of a light transmitting window, and a solid image pickup device. Also, the solid image pickup device is mounted on the substrate with the light receiving surface thereof in alignment with the transparent window by directly bump bonding electrodes of the image pickup device to the corresponding electrodes on the part of the substrate.

REFERENCES:
patent: 4594613 (1986-06-01), Shinbori et al.
patent: 4745470 (1988-05-01), Yabe et al.
patent: 4757805 (1988-07-01), Yabe

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