Electronic enclosures having metal parts

Electricity: conductors and insulators – Boxes and housings – Hermetic sealed envelope type

Patent

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Details

357 74, 428433, H01L 2310

Patent

active

045729247

ABSTRACT:
A hermetically sealable enclosure for an electronic device. Layers of solder glass bond the lead frame to the enclosure base and to a metallic seal ring. The base and ring can be coated with thin layers of aluminum to promote bonding. The surfaces of the base and ring can be roughened to promote bonding.

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