Electronic enclosure with improved EMC performance

Details Electronic enclosure with improved EMC performance Electronic enclosure with improved EMC performance

2002-05-31

2003-04-15

Martin, David (Department: 2841)

Electricity: electrical systems and devices

Housing or mounting assemblies with diverse electrical...

For electronic systems and devices

C361S818000, C361S800000, C361S752000, C174S034000, C174S034000

Reexamination Certificate

active

06549426

ABSTRACT:

TECHNICAL FIELD
The present invention relates generally to an electronic enclosure with improved EMC performance. More specifically, the present invention relates to an electronic enclosure with improved EMC performance capable of operating within a hostile environment.
BACKGROUND OF THE INVENTION
A variety of design characteristics must be considered in the development of electronic applications. Cost, size, thermal capabilities, and operating limits must often be considered in order to produce a successfull end-product. One such characteristic that must be considered is known as Electro Magnetic Compatibility (EMC). Electronic products and components often radiate fields during operation. These fields can cause electro magnetic interference in surrounding products or components. Additionally, an electronic product or component must be protected from such radiated fields produced by neighboring electronics. Electro Magnetic Compatibility is the ability of such products or components to withstand localized radiated fields as well as the ability of such products to reduce the impact of their own radiated fields on neighboring components.
Although numerous coatings and casing agents have been developed in order to improve a component's EMC, often these solutions can run counter to other important design considerations. Manufacturing costs can be negatively impacted where additional coatings or manufacturing procedures are necessary. Weight and size restrictions can be negatively impacted wherein the EMC improving elements serve to increase a products dimensions. Coatings and casings can make proper thermal dissipation of the electronic component difficult. One particular design consideration of import to the automotive industry is the ability to withstand a corrosive environment.
Engine control modules, transmission controllers, and power train controllers are all often subjected to hostile environments. Design constraints commonly dictate such components be protected from such hostile environments through the use of a sealed or a semi-sealed housing. Additionally, however, these housings (or casings) must serve as an EMC barrier between the controllers and the surrounding environment. An enclosure that could successfully combine the characteristics of hostile environmental capabilities and EMC barrier improvement would be highly desirable. Furthermore, an enclosure design that could accomplish these goals without significant adverse impact on weight, cost, size, or thermal dissipation would be even further valued.
SUMMARY OF THE INVENTION
It is, therefore, an object of the present invention to provide an electronic enclosure with improved EMC performance. It is a further object of the present invention to provide an electronic enclosure capable of usage within hostile environments.
In accordance with the objects of the present invention, an electronics assembly is provided. The electronics assembly includes an electronics enclosure and an electronic component positioned within the electronics enclosure. The electronics enclosure includes a base element including a perimeter mating groove defined by an inner groove wall and an outer groove wall. The electronics enclosure additionally includes a cover element including a perimeter tongue element. The perimeter tongue element fits within the perimeter mating groove upon assembly of the electronics enclosure. The electronics enclosure further includes a plurality of crush ribs formed onto the perimeter tongue element. The plurality of crush ribs pierces the base element to create a contiguous protective shield surrounding the electronic component.
Other objects and features of the present invention will become apparent when viewed in light of the detailed description of the preferred embodiment when taken in conjunction with the attached drawings and appended claims.


REFERENCES:
patent: 2527908 (1950-10-01), Blitz
patent: D312618 (1990-12-01), Ambros
patent: 5354951 (1994-10-01), Lange, Sr. et al.
patent: 5565656 (1996-10-01), Mottahed
patent: 5600091 (1997-02-01), Rose
patent: 5880400 (1999-03-01), Leischner et al.

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