Electronic element wafer module and method for manufacturing...

Details Electronic element wafer module and method for manufacturing... Electronic element wafer module and method for manufacturing...

2009-08-12

2011-11-15

Tran, Tan N (Department: 2826)

Active solid-state devices (e.g., transistors, solid-state diode

Alignment marks

C257S098000, C257SE23179, C257SE21540, C257SE21122, C438S401000

Reexamination Certificate

active

08058737

ABSTRACT:
An electronic element wafer module is provided, in which a transparent support substrate is disposed facing a plurality of electronic elements formed on a wafer and a plurality of wafer-shaped optical elements are disposed on the transparent support substrate, where a groove is formed along a dicing line between the adjacent electronic elements, penetrating from the optical elements through the transparent support substrate, with a depth reaching a surface of the wafer or with a depth short of the surface of the wafer; and a light shielding material is applied on side surfaces and a bottom surface of the groove or is filled in the groove, and the light shielding material is applied or formed on a peripheral portion of a surface of the optical element, except for on a light opening in a center of the surface.

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Chinese Office Action and English language translation mailed Sep. 7, 2010 in corresponding Chinese Patent Application 200910166685.6.

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