Semiconductor device manufacturing: process – Packaging or treatment of packaged semiconductor – Assembly of plural semiconductive substrates each possessing...
Reexamination Certificate
2007-10-30
2007-10-30
Wilczewski, M. (Department: 2822)
Semiconductor device manufacturing: process
Packaging or treatment of packaged semiconductor
Assembly of plural semiconductive substrates each possessing...
C438S125000, C438S117000
Reexamination Certificate
active
10966617
ABSTRACT:
Apparatuses and methods for forming displays are claimed. One embodiment of the invention relates to depositing a plurality of blocks onto a substrate and is coupled to a flexible layer having interconnect deposited thereon. Another embodiment of the invention relates to forming a display along a length of a flexible layer wherein a slurry containing a plurality of elements with circuit elements thereon washes over the flexible layer and slides into recessed regions or holes found in the flexible layer. Interconnect is then deposited thereon. In another embodiment, interconnect is placed on the flexible layer followed by a slurry containing a plurality of elements.
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Craig Gordon S. W.
Gengel Glenn Wilhelm
Hadley Mark A.
Jacobsen Jeffrey Jay
Smith John Stephen
Alien Technology Corporation
Blakely , Sokoloff, Taylor & Zafman LLP
Wilczewski M.
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