Electronic devices, method for forming end terminations thereof

Details Electronic devices, method for forming end terminations thereof Electronic devices, method for forming end terminations thereof

1991-03-20

1992-07-07

Griffin, Donald

Electricity: electrical systems and devices

Electrostatic capacitors

Fixed capacitor

29 2542, 419 19, H01G 100, H01G 700, B22F 700

Patent

active

051288273

ABSTRACT:
An improved electronic device having metal-glazing type end terminations comprising a surface metal phase of Sn or Zn, is produced by sintering a paste material containing a matrix metal powder (Cu and/or Ni), a fluxing metal powder and an organic binding material, so that the surface portion serves to improve wettability and solderability of the end termination owing to its composition being similar to solder.

REFERENCES:
patent: 4130854 (1978-12-01), Hertz
patent: 4353153 (1982-10-01), Prakash
patent: 4451869 (1984-05-01), Sakabe et al.
patent: 4517155 (1985-05-01), Prakash et al.
patent: 4740863 (1988-04-01), Langlois
patent: 4881308 (1989-11-01), McLaughlin et al.

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