Active solid-state devices (e.g. – transistors – solid-state diode – Housing or package – With contact or lead
Reexamination Certificate
2011-03-01
2011-03-01
Smith, Zandra (Department: 2822)
Active solid-state devices (e.g., transistors, solid-state diode
Housing or package
With contact or lead
C257S691000, C257SE23055, C257SE23065, C257SE23177
Reexamination Certificate
active
07898074
ABSTRACT:
A packaged electronic device includes a die, a flexible circuit structure, and a barrier film disposed on the die. The die includes die circuitry and electrical contacts. The flexible circuit structure is bonded directly to the die, and includes electrical conductors encapsulated by structural layers. Each electrical conductor contacts a respective electrical contact. The electronic device is encapsulated by the barrier film and one or more of the structural layers.
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Eckhardt Helmut
Ufer Stefan
Gloekler David P.
Patton Paul E
Smith Zandra
The Eclipse Group LLP
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