Electronic devices having metallurgies containing copper-semicon

Details Electronic devices having metallurgies containing copper-semicon Electronic devices having metallurgies containing copper-semicon

1994-02-22

1999-01-05

Lam, Cathy F.

Stock material or miscellaneous articles

Structurally defined web or sheet

Discontinuous or differential coating, impregnation or bond

428433, 428901, 174256, 174259, 257783, 257784, 228 563, B32B 300, H01L 2348, B23K 3514

Patent

active

058559930

ABSTRACT:
Silicon and germanium containing materials are used at surface of conductors in electronic devices. Solder can be fluxlessly bonded and wires can be wire bonded to these surfaces. These material are used as a surface coating for lead frames for packaging integrated circuit chips. These materials can be decal transferred onto conductor surfaces or electrolessly or electrolytically disposed thereon.

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