Electricity: electrical systems and devices – Housing or mounting assemblies with diverse electrical... – For electronic systems and devices
Reexamination Certificate
2007-07-03
2007-07-03
Datskovsky, Michael (Department: 2835)
Electricity: electrical systems and devices
Housing or mounting assemblies with diverse electrical...
For electronic systems and devices
C361S816000, C361S818000
Reexamination Certificate
active
11345482
ABSTRACT:
An electronic device with uniform heat-dissipation is disclosed. The electronic device comprises a housing, a circuit board, and a metal shielding. The housing has concavities at inner sides thereof, and the circuit board is disposed within the housing. The metal shielding is disposed between the housing and the circuit board and has protrusions at outer sides thereof to match up the concavities of the housing. Thereby, the metal shielding substantially stays close to the housing for allowing the electronic device to dissipate heat uniformly.
REFERENCES:
patent: 5028740 (1991-07-01), Tomiya
patent: 5124889 (1992-06-01), Humbert et al.
patent: 5235492 (1993-08-01), Humbert et al.
patent: 5461545 (1995-10-01), Leroy et al.
patent: 5532427 (1996-07-01), Stoyko
patent: 5864088 (1999-01-01), Sato et al.
patent: 5920984 (1999-07-01), Persson et al.
patent: 6031732 (2000-02-01), Koike et al.
patent: 6313400 (2001-11-01), Mosquera et al.
patent: 2005/0206357 (2005-09-01), Laurent et al.
patent: 2006/0109634 (2006-05-01), Lee et al.
patent: WO 03/094585 (2003-11-01), None
Guo Qing
Li Bao Hua
Lin Dong
Zhang Jin Fa
Datskovsky Michael
Delta Electronics , Inc.
Hoffberg Robert J.
LandOfFree
Electronic device with uniform heat-dissipation does not yet have a rating. At this time, there are no reviews or comments for this patent.
If you have personal experience with Electronic device with uniform heat-dissipation, we encourage you to share that experience with our LandOfFree.com community. Your opinion is very important and Electronic device with uniform heat-dissipation will most certainly appreciate the feedback.
Profile ID: LFUS-PAI-O-3725041