Patent
1988-04-28
1989-06-20
James, Andrew J.
357 40, 357 54, 357 68, 357 55, 357 52, 357 53, H01L 2348
Patent
active
048413542
ABSTRACT:
The present invention is intended to enhance the moisture-proofing of an electronic device having a chip including a substrate and a wiring structure which is formed on a major surface of the substrate and which consists of an electrical insulating film and metal wiring. A protective electrode which is made of a metal connecting to the substrate is provided between an outer periphery of the chip and the metal wiring formed in a peripheral part of the chip in a manner to penetrate the electrically insulating film.
REFERENCES:
patent: 3751292 (1973-08-01), Kongable
patent: 3801880 (1974-04-01), Harada et al.
patent: 3997964 (1976-12-01), Holbrook et al.
patent: 4001870 (1977-01-01), Saiki et al.
patent: 4040083 (1977-08-01), Saiki et al.
patent: 4472730 (1984-09-01), Ohta
Hitachi , Ltd.
James Andrew J.
Mintel William A.
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