Electronic device with high wettability solder pads

Details Electronic device with high wettability solder pads Electronic device with high wettability solder pads

1998-07-17

2000-04-11

Mayekar, Kishor

Stock material or miscellaneous articles

All metal or with adjacent metals

Composite; i.e., plural, adjacent, spatially distinct metal...

22818022, 29840, B32B 1500

Patent

active

060486295

ABSTRACT:
An electronic device has a layer of high wettability tin-bismuth solder alloy on component leads and substrate pads. The solder is electrodeposited onto copper with an electrodeposition bath containing a zinc salt, although no zinc is co-deposited on the copper. The tin-bismuth layer has a low quantity of oxygen thereby increasing the wettability and decreasing the oxidation at the surface after reflowing.

REFERENCES:
patent: 5816473 (1998-10-01), Nishikawa et al.

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