Electronic device with heat-dissipation structure

Details Electronic device with heat-dissipation structure Electronic device with heat-dissipation structure

2008-01-29

2008-01-29

Nasri, Javaid H. (Department: 2839)

Electricity: electrical systems and devices

Housing or mounting assemblies with diverse electrical...

For electronic systems and devices

Reexamination Certificate

active

11287023

ABSTRACT:
An electronic device with a heat-dissipation structure is disclosed. The electronic device comprises a housing, a printed circuit board assembly, and a heat sink. The printed circuit board assembly is disposed in an interior of the housing, and the printed circuit board assembly forms a high-temperatured heat flow area and a low-temperatured heat flow area in the electronic device. The heat sink is disposed between the printed circuit board assembly and the housing and in the low-temperatured heat flow area for balancing heat flow and homogenizing temperature of the electronic device to enhance heat-dissipation efficiency.

REFERENCES:
patent: 4122508 (1978-10-01), Rumbaugh

Affiliated with

Also associated with

Rating

Electronic device with heat-dissipation structure does not yet have a rating. At this time, there are no reviews or comments for this patent.

If you have personal experience with Electronic device with heat-dissipation structure, we encourage you to share that experience with our LandOfFree.com community. Your opinion is very important and Electronic device with heat-dissipation structure will most certainly appreciate the feedback.

Rate now

Comments { 0 }

Profile ID: LFUS-PAI-O-3929176