Electronic device with heat dissipation module

Electricity: electrical systems and devices – Housing or mounting assemblies with diverse electrical... – For electronic systems and devices

Reexamination Certificate

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Details

C361S679540, C361S690000, C361S703000, C361S704000, C361S709000, C361S719000, C454S184000

Reexamination Certificate

active

08059401

ABSTRACT:
An electronic device includes a printed circuit board and a heat dissipation module. The printed circuit board has a first heat-generating electronic component and a number of second heat-generating electronic components. The heat dissipation module includes a heat sink thermally engaging on the first heat-generating electronic component and an enclosure enclosing the printed circuit board. The heat sink includes a number of fins. The enclosure extends an inner casing to envelop the fins of the heat sink. The enclosure defines a number of slots letting the casing communicate with an exterior of the enclosure. The casing separates the fins from the second heat-generating electronic component.

REFERENCES:
patent: 6094345 (2000-07-01), Diemunsch
patent: 6113485 (2000-09-01), Marquis et al.
patent: 6940716 (2005-09-01), Korinsky et al.
patent: 7265984 (2007-09-01), Numata
patent: 7652882 (2010-01-01), Korinsky et al.
patent: 7724526 (2010-05-01), Hinze et al.
patent: 2003/0210524 (2003-11-01), Berg et al.
patent: 2006/0023419 (2006-02-01), Kao et al.
patent: 2006/0187643 (2006-08-01), Tsurufusa
patent: 2006326102 (2006-12-01), None

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