Electronic device with heat dissipating structure

Details Electronic device with heat dissipating structure Electronic device with heat dissipating structure

2011-08-02

2011-08-02

Datskovskiy, Michael V (Department: 2835)

Electricity: electrical systems and devices

Housing or mounting assemblies with diverse electrical...

For electronic systems and devices

C361S679480, C361S679500, C361S695000, C361S719000, C165S080300, C165S104330, C165S122000

Reexamination Certificate

active

07990704

ABSTRACT:
An electronic device includes a first and a second air passages. A first and a second electronic components locate in the first and second air passages, respectively. A first heat sink includes a first heat dissipation portion contacting the first electronic component and located in the first air passage and a second heat dissipation portion located in the second air passage. A second heat sink includes a first heat dissipation portion contacting the second electronic component and located in the second air passage and a second heat dissipation portion located in the first air passage. The first heat dissipation portion of the first heat sink aligns with the second heat dissipation portion of the second heat sink and the second heat dissipation portion of the first heat sink aligns with the first heat dissipation portion of the second heat sink along a flowing direction of the t air passage.

REFERENCES:
patent: 6215662 (2001-04-01), Peter et al.
patent: 6442024 (2002-08-01), Shih
patent: 6888725 (2005-05-01), Kubo et al.
patent: 6958914 (2005-10-01), Hoss
patent: 7027299 (2006-04-01), Wrycraft et al.
patent: 7206206 (2007-04-01), Lin et al.
patent: 7310226 (2007-12-01), Chen et al.
patent: 7391618 (2008-06-01), Fujiya et al.
patent: 7405932 (2008-07-01), Vinson et al.
patent: 7558065 (2009-07-01), Fang et al.
patent: 7623346 (2009-11-01), Fujiya et al.
patent: 2008/0041562 (2008-02-01), Bhatia

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