Electricity: electrical systems and devices – Housing or mounting assemblies with diverse electrical... – For electronic systems and devices
Reexamination Certificate
2011-06-21
2011-06-21
Semenenko, Yuriy (Department: 2835)
Electricity: electrical systems and devices
Housing or mounting assemblies with diverse electrical...
For electronic systems and devices
C361S737000, C361S752000, C361S760000, C361S790000
Reexamination Certificate
active
07965520
ABSTRACT:
An electronic device is provided that includes a main printed circuit board (PCB) having a top surface, a bottom surface, and a hole extending between the top surface and the bottom surface. The electronic device further includes a module PCB having at least one electrical component mounted on a top surface of the module PCB, wherein the module PCB is inverted and assembled adjacent the main PCB such that the top surface of the module PCB faces the top surface of the main PCB, and the at least one electrical component extends into the hole. In addition, the electronic device includes a cover on the bottom surface of the main PCB that substantially covers the hole.
REFERENCES:
patent: 4843225 (1989-06-01), Hoppe
patent: 5608262 (1997-03-01), Degani et al.
patent: 5617297 (1997-04-01), Lo et al.
patent: 5650755 (1997-07-01), Avanic et al.
patent: 6320256 (2001-11-01), Ho
patent: 6544047 (2003-04-01), Moore
patent: 6693362 (2004-02-01), Seyama
patent: 6867981 (2005-03-01), Murohara
patent: 7076870 (2006-07-01), Hsieh
patent: 7306144 (2007-12-01), Moore
patent: 2001/0033478 (2001-10-01), Ortiz et al.
patent: 2002/0079568 (2002-06-01), Degani et al.
patent: 2004/0203260 (2004-10-01), Block et al.
patent: 2005/0012192 (2005-01-01), Saso
patent: 2006/0027913 (2006-02-01), Lungwitz
patent: 2008/0042250 (2008-02-01), Wilson et al.
International Search Report for corresponding Application No. PCT/IB2007/002063 mailed Feb. 1, 2008.
Bygdö Håkan
Holmberg Per
Aychillhum Andargie M
Renner , Otto, Boisselle & Sklar, LLP
Semenenko Yuriy
Sony Ericsson Mobile Communications AB
LandOfFree
Electronic device with flip module having low height does not yet have a rating. At this time, there are no reviews or comments for this patent.
If you have personal experience with Electronic device with flip module having low height, we encourage you to share that experience with our LandOfFree.com community. Your opinion is very important and Electronic device with flip module having low height will most certainly appreciate the feedback.
Profile ID: LFUS-PAI-O-2728913