Active solid-state devices (e.g. – transistors – solid-state diode – Housing or package – Insulating material
Reexamination Certificate
2007-10-12
2009-10-27
Soward, Ida M (Department: 2822)
Active solid-state devices (e.g., transistors, solid-state diode
Housing or package
Insulating material
C257S675000, C257S688000, C257S706000, C257S712000, C257S713000, C257S720000, C257SE23101, C257SE23102, C257SE23104
Reexamination Certificate
active
07608923
ABSTRACT:
A package module is provided. The package module includes a substrate having a surface including a die region. A die is disposed in the die region of the surface on the substrate. A flexible heat spreader conformally covers the surface of the substrate and the die. The invention also discloses an electronic device with the package module.
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Soward Ida M
Thomas Kayden Horstemeyer & Risley
Via Technologies Inc.
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