Electronic device substrate using silicon semiconductor substrat

Superconductor technology: apparatus – material – process – High temperature – per se – Having tc greater than or equal to 150 k

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505701, 505702, 505703, 505704, 428426, 428432, 428433, 428688, 428700, 428901, 428930, B32B 900

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active

050844385

ABSTRACT:
An electronic device substrate includes a spinel epitaxial film formed on a silicon single-crystal substrate and an oxide superconductor layer formed on the spinel film. The oxide superconductor layer is represented by formula P.sub.x (Q,Ca).sub.y Cu.sub.z O.sub..delta. and contains at least one element of Bi and Tl as P and at least one element of Sr and Ba as Q. Composition ratios fall within ranges of 0.08.ltoreq.x/(x+y+z).ltoreq.0.41, 0.29.ltoreq.y/(x+y+z).ltoreq.0.47 and 1.ltoreq.Q/Ca.ltoreq.3.

REFERENCES:
CA 111 (24): 223259c, Chak et al., 1989, 76-4 Electric Phenomena.
CA 110 (8): 67103u, Miura et al., 1988, Appl. Phys. Letts. 53 (20) 1967-9.
CA 109 (6): 46792g, Nasu et al., 1988, Jp. Journ. Appl. Phys., Part 2, 27 (4) L634-L635.
"Formation of Si Epi./MgO.Al.sub.2 O.sub.3 Epi./SiO.sub.2 /Si and Its Epitaxial Film Quality" by Masao Mikami et al., Extended Abstracts of the 15th Conference on Solid State Devices and Mateials, Tokyo 1983, pp. 31-34.

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