Active solid-state devices (e.g. – transistors – solid-state diode – Combined with electrical contact or lead – Ball or nail head type contact – lead – or bond
Reexamination Certificate
2005-06-16
2009-11-03
Vu, David (Department: 2818)
Active solid-state devices (e.g., transistors, solid-state diode
Combined with electrical contact or lead
Ball or nail head type contact, lead, or bond
C257S751000, C257S753000, C257SE23021, C257SE21508, C257SE23041
Reexamination Certificate
active
07612456
ABSTRACT:
An inventive electronic device includes a substrate, a bump of a first metal material provided on a surface of the substrate, a bonding film of a second metal material provided on a top surface of the bump for bonding the electronic device to an electrical connection portion of a second device, the second metal material having a lower melting point in an elemental state than an alloy of the first metal material and the second metal material, and a diffusion prevention film of a third metal material provided between the top surface of the bump and the bonding film as covering at least part of the top surface of the bump, the third metal material having a lower diffusion coefficient than the second metal material with respect to the first metal material.
REFERENCES:
patent: 5367195 (1994-11-01), DiGiacomo et al.
patent: 6011313 (2000-01-01), Shangguan et al.
patent: 6133637 (2000-10-01), Hikita et al.
patent: 6249051 (2001-06-01), Chang et al.
patent: 6501185 (2002-12-01), Chow et al.
patent: 6786385 (2004-09-01), Kitajima et al.
patent: 2002/0047217 (2002-04-01), Zakel et al.
patent: 2002/0090805 (2002-07-01), Yap et al.
patent: 2003/0075791 (2003-04-01), Shibata
patent: 2003/0141593 (2003-07-01), Zuniga-Ortiz et al.
patent: 2004/0137708 (2004-07-01), Shibata
patent: 2004/0169286 (2004-09-01), Shibata
patent: 2005/0026413 (2005-02-01), Lee et al.
patent: 2005/0151268 (2005-07-01), Boyd et al.
patent: 2005/0224991 (2005-10-01), Yeo
patent: 2006/0016861 (2006-01-01), Daubenspeck et al.
patent: 54-159173 (1979-12-01), None
patent: 62-117346 (1987-05-01), None
patent: 2002-190490 (2002-07-01), None
patent: 2002-289768 (2002-10-01), None
patent: 2003-133508 (2003-05-01), None
patent: 2004-79685 (2004-03-01), None
ASM Handbook, vol. 3, Alloy Phase Diagrams, 1992.
Fujii Sadamasa
Nishioka Taro
Rabin & Berdo P.C.
Rohm & Co., Ltd.
Taylor Earl N
Vu David
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