Electronic device sealing resin compositions and sealed electron

Details Electronic device sealing resin compositions and sealed electron Electronic device sealing resin compositions and sealed electron

1992-08-06

1994-07-26

Bleutge, John C.

Synthetic resins or natural rubbers -- part of the class 520 ser

Synthetic resins

At least one aryl ring which is part of a fused or bridged...

524265, 524267, C08K 524

Patent

active

053327705

ABSTRACT:
Disclosed herein are electronic device sealing resin compositions containing (A) 40-25 parts by weight of a thermoplastic resin composed of 100-10 wt. % of a poly(arylene thioether-ketone) and 0-90 wt. % of a poly(arylene sulfide), (B) 60-75 parts by weight of an inorganic filler, and per 100 parts by weight of the sum of the thermoplastic resin (A) and inorganic filler (B), (C) 1.5-5 parts by weight of a silicone oil, (D) 10-15 parts by weight of a silicone rubber or (C) 0.5-3 parts by weight of a silicone oil and (D) 5-13 parts by weight of a silicone rubber. Electronic devices sealed using such resin compositions are also disclosed.

REFERENCES:
patent: 3929708 (1975-12-01), Brady et al.
patent: 4370292 (1983-01-01), Yanase et al.
patent: 4395527 (1983-07-01), Berger
patent: 4474906 (1984-10-01), Nakama et al.
patent: 4703075 (1987-10-01), Egami
patent: 4785057 (1988-11-01), Shiiki et al.
patent: 4797448 (1989-01-01), Liang et al.
patent: 4895892 (1990-01-01), Satake et al.
patent: 4895893 (1990-01-01), Satake et al.

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