Electronic device plated with gold by means of an electroless go

Details Electronic device plated with gold by means of an electroless go Electronic device plated with gold by means of an electroless go

1988-04-20

1990-10-16

Morris, Theodore

Stock material or miscellaneous articles

Composite

Of bituminous or tarry residue

428601, 428620, 428632, 428663, 428665, 428672, 174250, H01L 2308, H01L 2352

Patent

active

049639749

ABSTRACT:
The present invention relates to an electroless gold plating solution, a method of plating by using the same, and an electronic device plated with gold by using the same.
According to the present electroless gold plating solution, the plating solution components contain no cyanide ions, the amount of a reducing agent used is small, and gold plating can be carried out without causing the gold plating on conducting paths having a fine interval between them to short-circuit the conducting paths.
Therefore, according to the method of gold plating by using said electroless gold plating solution, a plating method that is safe in the plating work and in the treatment of its waste liquor can be accomplished. The method has a feature that the method can provide an electronic device on which parts can be mounted highly densely, and wherein the joint reliability to the parts is high.

REFERENCES:
patent: 4152601 (1979-05-01), Kadota et al.
patent: 4288841 (1981-09-01), Gogal
patent: 4551747 (1985-11-01), Gilbert et al.
patent: 4626479 (1986-12-01), Hosoi et al.
patent: 4675243 (1987-06-01), Obinata et al.
patent: 4681654 (1987-07-01), Clementi et al.
patent: 4707394 (1987-11-01), Chant
patent: 4724472 (1988-02-01), Sugimoto et al.
patent: 4786523 (1988-11-01), Dohya
patent: 4797508 (1989-01-01), Chant

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