Electrical connectors – Preformed panel circuit arrangement – e.g. – pcb – icm – dip,... – With provision to conduct electricity from panel circuit to...
Patent
1989-01-25
1989-11-28
Briggs, William
Electrical connectors
Preformed panel circuit arrangement, e.g., pcb, icm, dip,...
With provision to conduct electricity from panel circuit to...
361413, H01R 990
Patent
active
048834297
ABSTRACT:
An electronic device packaging structure, in which a plurality of electronic circuit packages are arrayed on one side of a back panel with their signal input/output terminals projecting out onto the other side of the panel and each connected to one end of one of plural wiring cables. The other ends of the wiring cables are connected to relay connectors, which are fixed to a common frame, constituting a back panel system. A pair of such back panel systems are detachably coupled together via the relay connectors.
REFERENCES:
patent: 4498717 (1985-02-01), Reimer
patent: 4514784 (1985-04-01), Williams
patent: 4573753 (1986-03-01), Vogl
patent: 4686607 (1987-08-01), Johnson
patent: 4689721 (1987-08-01), Dameron et al.
patent: 4733461 (1988-03-01), Nakano
Suzuki Takao
Uekido Kouzou
Briggs William
Japan Aviation Electronics Industry Limited
NEC Corporation
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