Electronic device package manufacturing method and...

Details Electronic device package manufacturing method and... Electronic device package manufacturing method and...

2006-01-26

2009-11-10

Ho, Tu-Tu V (Department: 2818)

Semiconductor device manufacturing: process

Packaging or treatment of packaged semiconductor

C438S115000, C438S667000, C257S693000, C257S690000, C257S698000, C257SE23011, C257SE23067

Reexamination Certificate

active

07615406

ABSTRACT:
By joining a lid member to a base member, internal electrodes put in contact with the lid member and an electronic device connected to the internal electrodes are placed in an internal space located in between the base member and the lid member. By performing etching from a surface of the lid member on a side opposite from the base member by a prescribed method, through holes that reach the surface of the internal electrodes are formed. A conductive material is applied to the through holes, and external electrodes connected to the internal electrodes are formed in a plane, completing a thin type electronic device package.

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Patent Cooperation Treaty (PCT) International Preliminary Report on Patentability, issued Jul. 31, 2007 in International Application No. PCT/JP2006/301209.

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