Electronic device package having electronic device boonded, at a

Details Electronic device package having electronic device boonded, at a Electronic device package having electronic device boonded, at a

1994-06-16

1995-12-05

Picard, Leo P.

Electricity: electrical systems and devices

Housing or mounting assemblies with diverse electrical...

For electronic systems and devices

361750, 361762, 361807, 174 524, 174256, 257778, H05K 702

Patent

active

054735122

ABSTRACT:
An electronic device, such as an integrated circuit chip or a multichip module, is held in place overlying a circuit board, with which it is thermal expansion mismatched, by three or more localized rigid support elements. The bottom surface of the chip is bonded to the top surface of preferably only one of these support elements and can laterally slide along the top surfaces of the others in response to heating and cooling during electrical operations of the electronic device. In addition, the electronic device is encapsulated in a soft gel that is held in place by a rigid plastic half-shell cover that is epoxy-bonded in place along its perimeter (edge).

REFERENCES:
patent: 5241133 (1993-08-01), Mullen, III et al.
patent: 5311059 (1994-05-01), Banerji et al.
patent: 5346118 (1994-09-01), Degani

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