Electronic device package and method for forming the same

Details Electronic device package and method for forming the same Electronic device package and method for forming the same

1996-08-05

1998-04-21

Kincaid, Kristine L.

Electricity: conductors and insulators

Boxes and housings

Hermetic sealed envelope type

174 524, 257704, 361688, H05K 506

Patent

active

057420076

ABSTRACT:
An electronic device package (10) is resistant to rupture at high temperatures. The electronic device package (10) includes a cap (14) having side-walls (18) coupled to a support structure (11) via an adhesive (15). The cap (14) is permeable to gases including water vapor. The side-walls (18) of the cap (14) are made of a porous ceramic material which absorbs a portion of the adhesive (15) via capillary action while curing the adhesive (15).

REFERENCES:
patent: 4809135 (1989-02-01), Yerman
patent: 5110784 (1992-05-01), Williams et al.
patent: 5248848 (1993-09-01), Kornowski et al.
patent: 5532513 (1996-07-01), Smith et al.

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