Electronic device package and electronic equipment

Details Electronic device package and electronic equipment Electronic device package and electronic equipment

2011-06-21

2011-06-21

Briggs, Nathanael R (Department: 2871)

Active solid-state devices (e.g., transistors, solid-state diode

Housing or package

With contact or lead

C349S149000, C349S151000

Reexamination Certificate

active

07964955

ABSTRACT:
This electronic device package includes a substrate upon which an electronic device is mounted, a plurality of device electrodes which are formed upon an electronic device, a plurality of substrate electrodes which are formed upon the substrate, and a plurality of connection lines, formed by a liquid drop ejection method, each of which electrically connects together one of the plurality of device electrodes and one of the plurality of substrate electrodes. The plurality of substrate electrodes are arranged in a staggered configuration.

REFERENCES:
patent: 5909055 (1999-06-01), Yamashita et al.
patent: 6479901 (2002-11-01), Yamada
patent: 6693359 (2004-02-01), Lin
patent: 7064421 (2006-06-01), Chiu et al.
patent: 2004/0173892 (2004-09-01), Nakanishi
patent: 2004/0188499 (2004-09-01), Nosaka
patent: 11-297246 (1999-10-01), None
patent: 2000-068694 (2000-03-01), None
patent: 2000-216330 (2000-08-01), None
patent: 2004-221257 (2004-08-01), None
patent: 2004-281539 (2004-10-01), None
patent: 2006-135216 (2006-05-01), None
patent: 222733 (1992-12-01), None

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