Electronic device package

Active solid-state devices (e.g. – transistors – solid-state diode – Housing or package

Patent

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Details

257690, 257698, 257704, 257734, H01L 2302, H01J 1500

Patent

active

053348745

ABSTRACT:
A package for a semiconductor device includes multiple layers which are fused together to encapsulate the device in a package which has a size approaching the size of the unpackaged device. The compact package facilitates heat transfer from the device, thus making it particularly advantageous for high power applications. Electrical contacts with the device are provided as contact pads on the surface of the package. Primary materials used in construction of the package include glass and ceramics, although other materials such as resins and epoxy could also be used. The multiple layers comprising the package are welded or fused together without having any adhesive, solder, etc. between the layers. Thus, the assembly of the package is an efficient one step process wherein electrical and thermal contacts with the electronic device are made simultaneously with the sealing operation.

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"Hughes Microglass Diode with the glass ambient junction", Hughes Product Brochure, Nov. 1961.

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