Active solid-state devices (e.g. – transistors – solid-state diode – Housing or package
Patent
1991-09-13
1994-08-02
LaRoche, Eugene R.
Active solid-state devices (e.g., transistors, solid-state diode
Housing or package
257690, 257698, 257704, 257734, H01L 2302, H01J 1500
Patent
active
053348745
ABSTRACT:
A package for a semiconductor device includes multiple layers which are fused together to encapsulate the device in a package which has a size approaching the size of the unpackaged device. The compact package facilitates heat transfer from the device, thus making it particularly advantageous for high power applications. Electrical contacts with the device are provided as contact pads on the surface of the package. Primary materials used in construction of the package include glass and ceramics, although other materials such as resins and epoxy could also be used. The multiple layers comprising the package are welded or fused together without having any adhesive, solder, etc. between the layers. Thus, the assembly of the package is an efficient one step process wherein electrical and thermal contacts with the electronic device are made simultaneously with the sealing operation.
REFERENCES:
patent: 3381080 (1968-04-01), Stelmak
patent: 3501833 (1970-03-01), Spiegler
patent: 3512254 (1970-05-01), Jenkins et al.
patent: 3648357 (1972-03-01), Green, Jr.
patent: 4025716 (1977-05-01), Morse
patent: 4649416 (1987-03-01), Borkowski et al.
patent: 4698663 (1987-10-01), Sugimoto et al.
patent: 4803546 (1989-02-01), Sugimoto et al.
patent: 4825282 (1989-04-01), Fukaya
patent: 4905075 (1990-02-01), Temple et al.
patent: 4907067 (1990-03-01), Derryberry
patent: 4922325 (1990-05-01), Smeltz, Jr.
patent: 4931854 (1990-06-01), Yonemasu et al.
patent: 4954877 (1990-09-01), Nakanishi et al.
patent: 4970577 (1990-11-01), Ogihara et al.
patent: 4985751 (1991-01-01), Shiobara et al.
patent: 4992628 (1991-02-01), Beppu et al.
patent: 5014115 (1991-05-01), Moser
"Hughes Microglass Diode with the glass ambient junction", Hughes Product Brochure, Nov. 1961.
Kalatsky Mark
Metzler Richard A.
LaRoche Eugene R.
Nguyen Viet Q.
LandOfFree
Electronic device package does not yet have a rating. At this time, there are no reviews or comments for this patent.
If you have personal experience with Electronic device package, we encourage you to share that experience with our LandOfFree.com community. Your opinion is very important and Electronic device package will most certainly appreciate the feedback.
Profile ID: LFUS-PAI-O-66790