Electronic device mounting structure for busbar

Details Electronic device mounting structure for busbar Electronic device mounting structure for busbar

2008-09-03

2011-11-08

Bui, Hung S (Department: 2835)

Electricity: electrical systems and devices

Housing or mounting assemblies with diverse electrical...

For electronic systems and devices

C361S813000

Reexamination Certificate

active

08054647

ABSTRACT:
An electronic device mounting structure includes an electronic device, a busbar, and a solder. The electronic device has a body and a lead protruding from the body. The busbar has a flat portion and a wall portion rising from a periphery of the flat portion. The flat portion of the busbar extends parallel to a tip portion of the lead and is in contact with a back surface of the tip portion. The wall portion of the busbar faces a side surface of the tip portion with a predetermined space. The solder is located in the space and joins the side surface of the tip portion and the wall portion of the busbar.

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Japanese Office Action dated Aug. 27, 2009, issued in corresponding Japanese Application No. 2007-228083, with English translation.

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