Electronic device mounting method

Details Electronic device mounting method Electronic device mounting method

1996-02-22

1998-09-08

Echols, P. W.

Metal working

Method of mechanical manufacture

Electrical device making

22818022, H05K 334

Patent

active

058027122

ABSTRACT:
An electronic device includes a substrate, a chip attached thereon, and a molded body formed on the substrate for sealing the chip on the substrate. The electronic device further includes bumps formed at the underside of the substrate for connection to electrodes of a printed board. In an electronic device mounting method, a first correlation between a magnitude of warp of the electronic device and a heating temperature of the electronic device is derived. The warp is caused by a difference in thermal expansion coefficient between the molded body and the substrate. In the method, a second correlation between the magnitude of warp of the electronic device and a failure rate of coupling between the bumps and the electrodes is further derived. The method further derives, based on the first and second correlations, a heating temperature which causes no coupling failure between the bumps and the electrodes. Then, the electronic device is heated up to a temperature no less than the derived heating temperature causing no coupling failure so as to melt the bumps for fixation onto the electrodes of the printed board.

REFERENCES:
patent: 4825284 (1989-04-01), Soga et al.
patent: 4897918 (1990-02-01), Osaka et al.
patent: 5192835 (1993-03-01), Bull et al.
patent: 5489750 (1996-02-01), Sakemi et al.

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