Electronic device manufacturing method, electronic device...

Electricity: electrical systems and devices – Housing or mounting assemblies with diverse electrical... – For electronic systems and devices

Reexamination Certificate

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C361S818000, C257S789000, C257S790000, C257S795000, C174S050510

Reexamination Certificate

active

06628526

ABSTRACT:

FIELD OF THE INVENTION
The present invention relates to (a) an electronic device manufacturing method and an electronic device which eliminates waste of materials and unnecessary manufacturing processes, and (b) a resin filling method in which a target region enveloping electronic parts is filled with a resin.
BACKGROUND OF THE INVENTION
In the past, there has been a rapid spread of compact electronic devices in which a plurality of electronic parts are mounted on a substrate. Electronic devices of this type include devices which are sealed or molded by means of a resin as in the case of ICs and hybrid modules, or the like. Electronic devices of this type also includes devices which are accommodated in a metal case or in which the electronic parts are covered by a metal case.
In the manufacture of such electronic devices, substrates have been prepared for individual electronic devices, and electronic parts have been mounted on these substrates, after which sealing or molding using a resin, or the mounting of a metal case, had been performed.
PROBLEMS TO BE SOLVED BY THE INVENTION
The following problems are encountered in manufacturing the above-mentioned electronic devices.
First of all, in the case of devices that are resin-sealed or molded by means of a resin, since there are indentations and projections on the surfaces of the electronic devices, the electronic devices may fall from the suction chucking machine and suction chucking is difficult to accomplish when the devices are mounted on motherboards using a suction chucking type automatic mounting machine.
Secondly, in the case of electronic devices that use a metal case, although such devices are superior in that they can be shielded from electromagnetic fields and the electronic parts on the substrate can be protected, a process in which metal cases are mounted on the individual substrates is required, and this is an obstacle to the reduction of manufacturing costs.
Thirdly, since compact substrates are formed for individual electronic devices, and the work of mounting electronic parts on these substrates is automated using machinery, extra parts must be provided in order to fasten the individual substrates in place during shipping and part mounting operations, so that a waste of substrate material is generated. Such extra parts used to fasten individual substrates in place are generally called “fastening parts” or “ears” by persons familiar with the art. The electronic devices are ultimately shipped as finished products after these “fastening parts” or “ears” have been cut off and discarded.
Fourth, it is extremely difficult to accomplish resin sealing of a single electronic part mounted on a substrate in isolation from the area surrounding said electronic part. In the past, therefore, considering ease of manufacturing, the entire electronic part has been resin-sealed, or resin sealing has been performed with the electronic parts surrounding the target electronic part included, even in cases where only a single electronic part requires resin sealing. This has resulted in a waste of sealing resin.
In light of the above problems, the object of the present invention is to provide an electronic device manufacturing method and an electronic device which make it possible to (1) reduce the waste of materials, (2) reduce the number of manufacturing steps, and (3) limit resin sealing to a specified target region.
SUMMARY OF THE INVENTION
A. In order to achieve the above-mentioned objects, the present invention proposes a method for manufacturing an electronic device which has a substrate, electronic parts that are mounted on the main surface of said substrate, and a resin part that is formed on the main surface of the aforementioned substrate so that said resin part fills a specified space surrounding at least one electronic part, said electronic device manufacturing method comprising a step in which a collective substrate consisting of a plurality of substrates linked in the form of a matrix is formed, a step in which electronic parts are mounted on the main surface of the aforementioned collective substrate, a step in which the aforementioned resin part which is solidified so that it covers the aforementioned electronic parts is formed on the main surface of the collective substrate on which the aforementioned electronic parts have been mounted, and a step in which the collective substrate on which the aforementioned resin part has been formed is separated into individual substrates.
B. Additional benefits can be obtained by adding to the method described in the previous paragraph a step in which terminal electrode members are conductively connected and mounted across specified adjacent substrates on the upper surface of the collective substrate prior to the formation of the aforementioned resin part, so that these terminal electrode members cross the boundary lines of the adjacent substrates. The aforementioned resin part is formed to a specified thickness over the entire main surface of the collective substrate during the step in which the resin part is formed, and the terminal electrode members are cut in the step in which the collective substrate on which the aforementioned resin part has been formed is separated into individual substrates.
C. The aforementioned terminal electrode members are cut in the step in which the aforementioned collective substrate is separated into individual substrates; accordingly, the cut surfaces of the terminal electrode members are exposed at the cut surfaces of the aforementioned resin part, so that the terminal electrode members can be used as terminal electrodes. As a result, working of the terminal electrodes can easily be accomplished, and electronic devices manufactured by this method can be mounted with the side surfaces of said devices, i.e., the aforementioned cut surfaces, facing the motherboard. In addition, an intermediate layer consisting of an insulating elastic material can be formed on the main surface of the collective substrate (on which the aforementioned electronic parts have been mounted) prior to the formation of the resin part, so that said intermediate layer covers the electronic parts. This intermediate layer alleviates stresses generated by thermal expansion. Differences in the thermal expansion coefficients of the substrate, solder and resin part are alleviated by the intermediate layer.
D. Furthermore, in the methods described above, it is possible to use a vacuum printing method to form the resin part, so that a resin part having a specified thickness is formed over the entire main surface of the collective substrate. The use of a vacuum printing method allows formation of a resin part without any gaps around the electronic parts. Vacuum printing can be accomplished, for example, using Vacuum Printing Encapsulation Systems such as are available from Japan Rec. Co. LTD. of Takatsuki-shi, Osaka, Japan.
E. Furthermore, it is possible to dispose a resin in a vacuum state in a region which includes at least one of the aforementioned electronic parts on the main surface of the aforementioned substrate and a specified space surrounding said electronic part, in isolation from other regions, and a step in which a further resin layer is subsequently formed on the surface of the aforementioned resin part in either a non-vacuum state or vacuum state. The further resin layer is formed on the surface of the resin part which, having been formed using a vacuum printing method, is evened out. Electronic devices manufactured in this way can easily be mounted on a motherboard using a suction chucking type automatic mounting machine.
F. An additional step can be added to the methods discussed above in which at least one layer selected from a set consisting of a heat-dissipating layer, an electromagnetic field shielding layer and a metal layer is formed in a specified region on the surface of the resin part following the formation of the resin part. The electromagnetic field shielding layer or metal layer formed on the surface of the resin part blocks electromagnetic fields. Accord

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