Metal fusion bonding – Process – With condition responsive – program – or timing control
Patent
1990-09-19
1991-11-19
Metal fusion bonding
Process
With condition responsive, program, or timing control
228191, 228264, 228 9, B23K 1018
Patent
active
050659332
ABSTRACT:
A robotically controlled pick-uo to tool (11) is modified by connecting to it a load cell (26) that generates a signal indicative of stress on the pick-up tool. The pick-up tool is directed toward a chip (12) to be removed and movement is stopped when the load cell generates a first signal indicative of a first level of stress. In addition to stopping movement of the pick-up tool, the first signal actuates heating of the tool to a temperature sufficient to melt the solder (13) bonding the chip to the substrate (14). The melting of the solder bonds (13) results in a reduction of stress on the tool, which causes the load cell (26) to generate a signal indicative of the second level of stress. The second signal actuates the vacuum of the pick-up tool to cause adhesion of the chip to the pick-up tool and also initiates movement of the pick-up tool so as remove the chip from the substrate.
REFERENCES:
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patent: 4561586 (1985-12-01), Abel et al.
patent: 4577513 (1986-03-01), Harwood et al.
patent: 4611296 (1986-09-01), Nidermayr
patent: 4854494 (1989-08-01), von Raben
patent: 4923521 (1990-05-01), Lui et al.
"Flip-Chip Replacement within the Constraints Imposed by Multilyaer Ceramic (MLC) Modules", K. J. Puttlitz, Journal of Electronic Materials, vol. 13, No. 1, 1984, pp. 29-47.
Anderson Roderick B.
AT&T Bell Laboratories
Heinrich Samuel M.
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