Electronic device, loop heat pipe and cooling device

Details Electronic device, loop heat pipe and cooling device Electronic device, loop heat pipe and cooling device

2008-12-08

2010-06-15

Datskovskiy, Michael V (Department: 2835)

Electricity: electrical systems and devices

Housing or mounting assemblies with diverse electrical...

For electronic systems and devices

C361S700000, C361S701000, C361S679470, C165S104210, C165S104260, C165S104330

Reexamination Certificate

active

07738248

ABSTRACT:
According to one embodiment, an electronic device includes a heat generating part housed inside a cabinet and a loop heat pipe housed inside the cabinet, which includes an internal flow path having a loop shape in which a working fluid is sealed. The loop heat pipe further includes a heat receiving unit, a heat radiating unit, a vapor flow path which allows a gasified portion of the working fluid to flow from the heat receiving unit towards the heat radiating unit, a liquid returning flow path which allows a liquefied portion of the working fluid to flow from the heat radiating unit towards the heat receiving unit, and a wick provided at a position adjacent to the vapor flow path inside the liquid returning flow path. The wick also serves as a partition portion which partitions the vapor flow path and the liquid returning flow path from each other.

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Japanese Patent Application No. 2008-048578 Notice of Reasons for Rejection, mailed Mar. 31, 2009, (English translation).
Japanese Patent Application No. 2008-048578 Final Notice of Rejection mailed Jun. 30, 2009 (English translation).

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