Electronic device interconnection techniques

Details Electronic device interconnection techniques Electronic device interconnection techniques

1994-10-24

1995-12-26

Thomas, Laura

Electricity: conductors and insulators

Conduits, cables or conductors

Preformed panel circuit arrangement

174260, 22818022, 361768, 361790, H05K 111

Patent

active

054779332

ABSTRACT:
An electronic device (11) has on one surface a first ball grid array (12) having a first area. The first ball grid array is bonded to a first intermediate interconnection member (13) having on an opposite surface a second ball grid array having the same number of solder balls (23) as the first array, but of a significantly larger area than that of the first array. Each of the solder balls (23) of the second ball grid array is connected by a connection comprising a conductive via ( 18, 19) extending through the first interconnection member (13) to one of the solder balls of the first ball grid array.

REFERENCES:
patent: 4744007 (1988-05-01), Watari et al.
patent: 4868712 (1989-09-01), Woodman
patent: 5155302 (1992-10-01), Nguyen
patent: 5354955 (1994-10-01), Gregor et al.
"Cost-Effective Interconnections," by T. Caulfield et al., Surface Mount Technology, Jul. 1993, pp. 18-20.
"Ball Grid Arrays Have Arrive," Manufacturing Market Insider, vol. 2, No. 9, pp. 1-4.
"BGAs Face Production Testing," D. Hattas, Advanced Packaging, Summer 1993, pp. 44-46.

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