Electronic device interconnection techniques

Details Electronic device interconnection techniques Electronic device interconnection techniques

1991-06-24

1992-10-13

Nimmo, Morris H.

Electricity: conductors and insulators

Conduits, cables or conductors

Combined

174261, 174264, 361414, 439 66, H02G 1508, H05K 100

Patent

active

051553023

ABSTRACT:
External connections are made in an electronic device (11) having on an upper surface an array of contact pads (12) by providing successively over the electronic device a first anisotropic member (13), a first flat insulator member (14) having on an upper surface a first conductor pattern (29), a second flat anisotropic conductor member (15), and a second flat insulator member (17) having on an upper surface a second conductor pattern (30). The two flat insulator members contain an array of conductive vias (25, 26) extending between opposite surfaces. The first anistropic conductor member (13) and a first array of conductive vias (25) extending through the first insulative member (14) interconnects a first plurality of contact pads (12) on the electronic device (11) to the first conductor pattern (29) which includes a peripheral array of contact pads (32) to which external connections are made. Means for interconnecting a second plurality of the contact pads on the electronic device to the second conductor pattern (30) comprise the second flat anisotropic conductor member (15) and a second array of conductive vias (26) extending through the second insulator member (17), the first array of conductive vias (25) and the first anisotropic conductor member (13).

REFERENCES:
patent: 3541222 (1970-11-01), Parks et al.
patent: 4209481 (1980-06-01), Kashiro et al.
patent: 4598166 (1986-07-01), Neese
patent: 4737112 (1988-04-01), Jin et al.
patent: 4744007 (1988-05-01), Watari et al.
patent: 4778635 (1988-10-01), Hechtman et al.
patent: 4843191 (1989-06-01), Thomas
patent: 4868712 (1989-09-01), Woodman
patent: 4998885 (1991-03-01), Beamen
"Applications and Reliability of the AT&T Elastomeric Conductive Polymer Interconnection (ECPI) System", J. A. Fulton et al., IEPS, Sep. 1990, pp. 930-943.

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